|Shenzhen Kingda Electronics Co.,Ltd is a professional SMT,DIP,PCB Assembly manufacture in China锛寃ith 10 years' development锛孋ompany factory building area 4000 square, Cooperation customers up to 500锛宼he main market is in Europe, South America, southeast Asia and Australia.
As a Electronic Manufacturing Services (EMS) provider Kingda focus on delivering excellent manufacturing service to industrial automotive, medical, telecommunications, consumer, traffic, Automotive components etc.
Kingda provide the turnkey services including research and development 锛圧&D锛夛紝PCB layout锛孭CB manufacturing锛孭CB assembly manufacturing锛孭CBA SMT锛宐uild锛宼esting.
With a high-quality development team and professional electronic BOM purchasing supply chain锛寃e focus on reducing customer costs, speeding products to market and helping gain a competitive edge.
Kingda has the ability to build 2-64 layer multilayer board designs produced and Mass production, High Performance Materials, Buried Capacitance, Hybrid Applications, Buried Resistors. HDI. We have 1000銕?perday production capability.
2Base Material for PCBFR4, CEM-1,TACONIC, Aluminium, High Tg Material, High frequency ROGERS ,TEFLON, ARLON, Halogen-free Material
3Rang of finish baords Thickness0.21-7.0mm
4Max size of finish board900MM*900MM
5Minimum Line width3mil (0.075mm)
6Minimum Line space3mil (0.075mm)
7Min space between pad to pad3mil (0.075mm)
8Minimum hole diameter0.10 mm
9Min bonding pad diameter10mil
10Max proportion of drilling hole and board thickness1:12.5
Finishing TreatmentHASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.
12Solder maskGreen, White, Red, Yellow, Black, Blue, transparent photosensitive solder mask, Strippable soldermask.
13Minimum thickness of solder mask10um
14Color of silk-screenWhite, Black, Yellow etc.
15E-Testing100% E-Testing (High Voltage Testing); Flying Probe Testing
16Other testImpedanceTesting,Resistance Testing, Microsection etc.,
17Date file formatGERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
18Special technological requirementBlind Buried Vias and High Thickness copper
19Thickness of Copper0.5-14oz (18-490um)
PCB lead time
LayerQuick Turn/Usual TimeMass production
Kingda have 6 high-speed production line锛孌IP line and 2 box build line. And equipped with AOI, XRAY, SPI, intelligent first tester. We have 10million point perday production capability.
PCB Assembly Capability
Minimum IC Pitch0.2mm
Maximum PCB size1200x 500mm
Minimum PCB thickness0.25mm
Minimum chip size:0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:74x74mm
BGA ball pitch:1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter:0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch:0.38mm (minimum), 2.54mm (maximum)
Volume:One piece to low volume production quantities
Low cost first article builds
Assembly type:Surface mount(SMT) assembly
Mixed(surface mount and through hole) technology
Single or double sided placement
Components type:Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch
Parts procurements:Turnkey(we supply the parts)
Consigned(you supply the parts)
You supply some parts, we do the rest
Other capabilities:Repair/rework services
Mold and plastic injection.
Our research and development team, focus on the MCU system research and development, to provide stable and cost control of the overall solution.
Kingda has strong quality control capability, Our production manufacture process strictly comply with ISO9001, ISO13485, IS0140001 quality system, keep on staff training, QC and QA inspect every process of production.
Our Supplier Chain
Our Certification Aluminum PCB Made in China